Reticle storage pod (rsp) transport system utilizing foup adapter plate

ABSTRACT

A combination of a FOUP (front opening unified pod) system and a reticle system utilized for the transport of wafers and a reticle system, the latter of which are used for transporting reticles from a first fabrication site to a further site at another location, and which provides for a unified system enabling the automated and trackable delivery of the reticles between these sites. Provided is a modified FOUP base structure, which is adapted to retain a reticle and to be able to employ existing equipment in a fabrication site which only necessitates a minimal modification of the equipment in order to render the latter universally adaptable to the combination of the systems.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the unique combining of a FOUP (frontopening unified pod) system utilized for the transport of wafers and areticle system, the latter of which are used for transporting reticlesfrom a first fabrication site to a further site at another location, andwhich provides for a unified system enabling the automated and trackabledelivery of the reticles between these sites.

In particular, the invention is directed to the provision of a uniquemodified FOUP base structure, which is adapted to retain a ReticleStorage Pod (RSP) and to be able to employ existing material transportequipment in a fabrication site which only necessitates a minimalmodification of the equipment in order to render the latter universallyadaptable to the combination of the systems.

In essence, the utilization of Reticle Storage Pods (RSPs) is well knownin the technology, wherein RSP carriers are conveyed on OHT (OverheadTransport) vehicles or conveyor tracks. Similarly, currently existingFOUP (front opening unified pod) Automated Material Handling Systems(AMHS) are employed in a generally segregated mode from the RPS carriersand, in effect, are designed for an independent operation, which is notcoordinated therewith. Consequently, it is intended, by means of thepresent invention, to provide a unique combination of such normallyunrelated systems, which combine the capabilities of automated RSPcarriers or transports with currently existing FOUP AMH systems.

At this time, currently existing fabrication automated systems handleFOUPs and RSP carriers on essentially the same OHT (Overhead Transport)vehicles or tracks in a separate and basically uncoordinated manner. Asa consequence, semiconductor fabrication is burdened with the additionof extensive structural and functional requirements needed to movereticles supporting wafers being processed to diverse areas or newfabrication regions, whereby such requirements may be prohibitive innature. Moreover, although manual transportation of the wafers andreticles is an option, this mode of operation is slow in functioning,and may, at times, result in excessive breakage and loss of reticles.Furthermore, an automated delivery of the components to otherfabrication locations or additions to existing fabrication sitesrequires the provision of an automated and readily trackable system,which is suited for the transport and controlling of the reticles beingconveyed between those sites or locations.

It is also important to be able to uniquely combine RSP transportationwith preexisting or currently employed FOUPs, the latter of which areequipped with an RSP adapter assembly and whereby any FOUP could retaina plurality of RSPs through a concept of utilization of a waferadaptation plate, which retains the RSPs, and which can be employed inconjunctive operation with end effectors and most robotic installationsutilized currently in the technology.

Presently, no combination of such RSP transport systems and FOUP AMHSsystems are known to be available, and these systems are ordinarilyemployed as independent and autonomously functioning installations invarious semiconductor processing and fabrication locales or sites.

2. Discussion of the Prior Art

Liu-Barba, et al., U.S. Pat. No. 6,655,898 B1, discloses an arrangementfor the cycling of FOUPs (front opening unified pods). The publicationis directed to an essentially stand-alone apparatus, which cycles FOUPs,hoisting the latter up and down and levering a counterbalancerelationship between two FOUPs which are involved in this process. Thishas nothing in common with providing a Reticle Storage Pod (RSP)arrangement, which is adapted to be combined with a FOUP transportsystem, as disclosed by the present invention.

Blattner, et al., U.S. Patent Publication No. 2003/0161 714 A1, does notdisclose an inter-building reticle transport arrangement and isprimarily directed to the provision of a storage and buffer system withtransport elements, which do not in any manner combine the normallydiverse transport systems for RSPs and FOUPs in a manner analogous tothat of the present invention.

Ow, et al., U.S. Pat. No. 6,165,268, discloses a method of providingmodifications for facilitating 200-millimeter wafer cassettes adapted tobe mounted for processing on a 300-millimeter wafer FOUP load port.Provided in the disclosed apparatus is an adapter fixture, which isplaced on a 300 millimeter load port kinematic loading pins and an open200 millimeter wafer cassette is adapted to be positioned thereon. Tothe contrary, the present invention describes a method and apparatus foradapting a 300-millimeter wafer transport system to transport reticles(RSPs) in a combined arrangement therewith.

Busby, U.S. Pat. No. 6,095,335, discloses an apparatus within a FOUParrangement adapted to accommodate differently sized wafers, such aspositioning 200-millimeter wafers inside a 300-millimeter FOUP through asize conversion capability. This has nothing in common with theadaptation of a conveyer system to combine transport Reticle StoragePods (RSPs) and FOUP transport systems for operation on a commontransport arrangement intended to extend between different fabricationfacilities and processing sites.

SUMMARY OF THE INVENTION

Accordingly, pursuant to the invention, there is provided a novel andunique combined or composite transportation system, which, in a reliablemanner, imparts an automated RSP (Storage Pod) transport capability toan existing FOUP (front opening unified pod) Automated Material HandlingSystem (AMHS). This is effected in that in a simple and inexpensivemode, it is possible to impart diverse capabilities to bothtransportation systems through the combination thereof in conveyingreticles containing semiconductor wafers from one fabrication facilityto a second facility or building locale, and wherein there is onlyrequired essentially a modified FOUP handling flange structure, andwherein, pursuant to a further modification, multiple RSPs can betransported in a FOUP.

In order to achieve the foregoing novel aspects, pursuant to theinvention there is provided a single or unitary track transport orconveying system for overhead transport vehicles (OHT) or tracks, whichis capable of handling both FOUPs and RSP carriers through the featurein that currently existing FOUPs are equipped with an RSP adapterassembly. Pursuant to the invention, the assembly, which adapts the RSPsto FOUPs, thereby implementing the combined transport capability, can bereadily installed in any FOUP, and may hold a plurality, preferably upto three RSPs, which are employed in transporting semiconductor wafers.Hereby, a suitable adapter, which is installed in connection with theFOUPs, may be of the same size as that for a 300 millimeter wafer,possessing three locating kinematic mount pins in order to simulate aload port, and whereby up to three RSPs can be simultaneouslytransported by a FOUP to any particular location or site within atransport region or processing areas, such as between variousfabrication buildings.

Moreover, pursuant to the present invention, an adapter of customizedconstruction may be provided, whereby the adapter is mounted inside aFOUP so as to also enable the latter to hold three RSPs. Concurrently,end effectors and robots are presently available whereby FOUPs arehandled in connection with the RSPs, and can be readily adapted in anovel and unique manner to the transfer device to remove and transferthe pods to load ports between the fabrication sites.

Accordingly, pursuant to the present invention, it is an object toprovide a unified system or arrangement for transporting RSPs in a FOUPtransport arrangement.

Pursuant to another object of the present invention, there is provided acapability of loading FOUPs in which an automated robot can read RSP andFOUP IDs, load RSPs into the FOUP and then transport the FOUP to anothertransfer station where the process may be reversed and the RSP deliveredas may be required in conformance with specific manufacturingrequirements.

A further object of the present invention resides in providing acombined or unified system whereby segregated automation transport loopsconsisting of a reticle transport and a FOUP transport arrangement areoperatively combined through a simple transport container modification.

Another object of the present invention is to provide structure forstoring and carrying at least one Reticle Storage Pod (RSP) in anadapted FOUP structure, and whereby there is also provided thecapability of simultaneously carrying multiple RSPs in the adaptive FOUPstructure.

Still another object of the present invention is to provide a novelstructure to handle RSPs in an RFA (Reticle FOUP Adapter Plate) locatedin a FOUP by providing an adapter modification in the FOUP.

Further means are provided to track the RSP versus rewriting to RFA orFOUP and then resetting after an overhead transport vehicle (OHT) isconveyed to a destination transfer station.

Pursuant to a further object of the invention there is provided anarrangement and a method of handling an RSP versus a FOUP stocker andRFA or a modified FOUP, including an arrangement for utilizing an OHTvehicle or device to, respectively, load and unload an RSP or multipleRSPs into a FOUP.

According to a further object of the invention there is provided anarrangement utilizing a conveyer to load an RSP into and out of a FOUP,and also to locate and secure an RSP via a wafer adapter design forpositioning the RSP into a FOUP.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference may now be made to the following detailed description ofpreferred embodiments of the invention, taken in conjunction with theaccompanying drawings; in which:

FIG. 1 illustrates a perspective, generally diagrammatic, representationof a reticle to FOUP interface stocker arrangement;

FIG. 2 illustrates a perspective representation of a reticle to FOUPadapter with a Reticle Storage Pod (RSP) arranged thereon and with anempty adapter located adjacent thereto;

FIG. 3 illustrates, generally diagrammatically, a side view of a ReticleStorage Pod (RSP) located on a RSP and FOUP conveyor structure;

FIG. 4 illustrates a top plan view of the conveyor of FIG. 3;

FIG. 5 illustrates a reticle SRC above the conveyor;

FIG. 6 illustrates a FOUP SRC above the conveyor;

FIGS. 7A through 7E illustrate diagrammatically the sequence of loadingand unloading of a Reticle Storage Pod (RSP) employed in connection withthe RSP FOUP conveyor;

FIG. 8 illustrates diagrammatically an RSP FOUP showing a reticle podfor semiconductor wafers, which are to be arranged therein;

FIG. 9 illustrates a sectional view taken along line 9-9 in FIG. 8;

FIG. 10 illustrates a plan view taken along line 10-10 in FIG. 8;

FIG. 11 illustrates a bottom view of the RSP FOUP showing a conveyortable utilized therewith;

FIGS. 12, 13 and 14 illustrate, generally diagrammatically, atop-loading RSP FOUP structure in, respectively, front, rear andpartly-sectional side views;

FIGS. 15, 16 and 17 illustrate, respectively, a top-loading RSP FOUPstructure in a load sequence; and

FIG. 18 illustrates a schematic representation of the RSP FOUP transportsystem extending between a first location to a further location alongthe route of conveyance of the combined reticle and FOUP RSP transportsystem.

DETAILED DESCRIPTION OF THE INVENTION

Reverting in particular detail to the invention, and as diagrammaticallyillustrated in FIG. 1, there is shown a reticle to FOUP interfacestocker 10 showing a first conveyor track 12 having a movable FOUP SRCvehicle 14 displaceably arranged thereon; and an LIM track system 16connected to the upper side surface of the reticle to FOUP interfacestocker; an RFA (reticle to FOUP adapter) storage 18 is at the top ofthe stocker 10, which is adapted to be arranged adjacent a FOUP unit 20and which is adapted to provide for the conveyance of pluralities ofstocked reticles to the LIM track system for transference along thetransport system.

Illustrated is also a track 22 showing a further vehicle 24 for areticle SRC and an RSP-to-FOUP-adapter arrangement and which istransportable through a two-way RSP input and output. A manual operatorinput/output device 26 is provided for, and is for the purpose ofreceiving the reticle and the FOUP arrangement.

As represented in FIG. 2 of the drawings, there is shown anRSP-to-FOUP-adapter (RFA) 30, with a side-by-side view of an adapter 30having an RSP positioned thereon, and an adjacent empty adapter, whereinthis construction of adapter has the same base form 32 as that of a FOUPand is handled from below by the stocker 10 and the LIM track system 16in a manner analogous to the manipulation of a FOUP.

As shown in FIG. 1, the RSPs are loaded and unloaded via the reticle SRChoist, and an RFA inventory is maintained in the therewith-dedicatedFOUP stocker 10.

The RFA inventory is controlled by means of a suitable RF pill, andutilized are FOUP and RSP kinematic positioning aspects through thesuitable addition of guides, which aid in loading and preventinadvertent RSP to adapter movement. The positioning is provided for bymeans of upstanding pins, preferably three (3) spaced pins, as shown inthe adjacent empty adapter of FIG. 2, and the RFAs are capable ofaccommodating both single RSPs or such multiple “six-pack” reticle pods;which, if desired, can be loaded at the manual I/O part of the stocker10.

As illustrated in FIG. 3 of the drawings, there is schematicallyillustrated a segment of a conveyor arrangement 50, which by way ofexample, may be a reticle roller conveyor, and having a reticle pod, asillustrated in FIG. 2, movably positioned thereon, and connected at oneend to a pick-and-place conveyor 52 mounting an RSP FOUP 54.

The reticle roller conveyer, as also shown in the top plan view of FIG.4, as well as end views of FIGS. 5 and 6, has the reticle SRC connectedthereto for receiving the reticle pods and also the RSP FOUP 54.

As shown in FIGS. 7A through 7E of the drawings, there are illustratedthe respective loading and unloading sequences, wherein the reticle isbeing loaded into the FOUP and then downwardly displaced so as to beadapted to be conveyed to a loading system for further transfer betweenmanufacturing sites. The reverse is also applicable thereto, in effect,the upward movement of empty FOUPs for loading again with RSPs.

As shown in FIGS. 8-11 of the drawings, there is illustrated an RSP FOUP70 showing an RSP 72 with a three-pin wafer mounting unit 74, and asuitable guide element 84, which is usually employed for the stationarypositioning of a 300 millimeter wafer standard FOUP. In this instance,the reticle port is arranged in a FOUP 78 and a flange 80 is providedfor adapting the FOUP to SRCs. The bottom of the RSP 72 includesstructure for support thereof on a conveyor table 87.

Referring now in specific detail to FIGS. 12-14 of the drawings,illustrated in FIG. 12 is a side view of a closed FOUP 90 showingReticle Storage Pods (RSPs) 92 for reticles arranged therein in astacked position. In this instance, as previously indicated, three (3)RSPs, each of which is adapted to support a reticle during theprocessing or manufacturing steps thereof, are located interiorly of theFOUP, and may be stacked therein utilizing the OHT 100, as illustratedin FIG. 15.

As shown in FIG. 12, the FOUP structure 90 includes a top flange 94adapted to be supported on an overhead transport track or vehicle (OHT),and wherein the FOUP illustrates a door 96 thereof with the RSP magazineattached thereto.

As illustrated in FIG. 13 of the drawings showing a side view of theFOUP body 90, with the door 96 removed; whereas in FIG. 14 of thedrawings, there is illustrated the FOUP door 96 in an open position withthe top RSP flange enabling removal of the nested RSPs, which containsreticles.

As illustrated in FIGS. 15-17, this discloses the RSP FOUP loadingsequence in connection with a top loading construction.

In particular, the FOUP overhead transport 100, as shown in FIG. 15,includes a structure 102, which is supported from an overhead transportrail 104, and which is adapted to engage a FOUP 106, the latter of whichmay contain RSPs in a stacked or superimposed nested position.

In the aspect of loading the RSPs with the RSP overhead transport (RSPOHT) 108, a further rail 110 has the RSP transport unit 112 arrangedthereon and which may be vertically displaceable, and which, as shown inFIG. 15, is adapted to load reticles into the opened portion or door ofthe FOUP 106. In this connection, a suitable sensor or sensors 114 maybe provided for detecting the RSPs, which are deposited into the opendoor portion 120 of the FOUP 106, which is opened using the door openermechanism 116, such as shown in FIG. 14 of the drawings, as previouslyreferred to.

Upon the RSPs having been loaded through the open portion of the FOUP,the RSP FOUP door 120 is closed, as illustrated in FIG. 16, so as toprovide a closed top loaded RSP FOUP 122, as shown, for example, in FIG.12 of the drawings, by being moved along a track portion 124 in ahorizontal manner. Thereafter, the RSP FOUP 122 is lifted upwardly intothe transport unit 126 for the RSP FOUP, for transporting the loaded RSPFOUP 122 to a further site for manufacture or processing, as describedhereinbelow.

Referring to FIG. 18 of the drawings, there is illustrated a schematicrepresentation of the transport of an RSP FOUP 122 between a differentmanufacturing or processing sites for semiconductor wafers or similarcomponents of integrated circuits or microprocessor devices.

As shown in the drawing, the RSP SRC 130 deposits the RSPs in the RSPFOUP transport conveyor, as provided for in FIGS. 15-17 of the drawings.

Thereafter, the FOUP SRCs and the RSP are transported into a standardFOUP stocker 132, which also combines the RSP and the wafer FOUP forfurther transport into an interbuilding stocker 134, whereupon the RSPsare then forwarded to a FOUP structure and the RSP and the RSPinterconnections are then removed from the FOUP conveyor at that furtherlocation, which may be at a manufacturing annex or further processingsite.

The entire transport procedure with the empty FOUPs may then be returnedto the initial locale or site so as to be able to again repeat theforegoing loading and transport procedure.

From the foregoing, it is clearly evident that due to the combinationand the use of an adapter, which correlates and combines the RSP withFOUP conveyor or transport systems, these separate transportarrangements can be combined to present a single straightforwardsolution at minimum cost and equipment modifications, and is adapted toincrease LIM capacity so as to also meet RFA quantity requirements.

The RSP is protected in a FOUP-like container, which permits handlingand transport by means of the top flange, as shown in FIGS. 8-11 of thedrawings, and an existing vertical motion capability of FOUP and RSPoverhead transport is employed to load and unload the RSPs, as shown inFIG. 3 of the drawings.

The provision of the unique FOUP opening system enables positioning theRSP FOUP for loading and is adapted to be employed for factory floorlevel automated OHT RSP loadings; factory floor level manual RSP loadingor sealing level automated OHT RSP loading.

The structure, as shown, is clearly adapted to enable the loading andunloading in an option of the Reticle Storage Pods in the FOUP shownwith the door with RSP magazine attached and with the FOUP opened andthe top OHT flange.

As indicated, the FOUP overhead transport track enables the FOUP OHTvehicle to engage the RSP FOUP and the FOUP door opener by means of thethrough-beam RSP sensors.

While the present invention has been particularly shown and describedwith respect to preferred embodiments thereof, it will be understood bythose skilled in the art that the foregoing and other changes in formsand details may be made without departing from the scope and spirit ofthe present invention. It is therefore intended that the presentinvention not be limited to the exact forms and details described andillustrated, but fall within the scope of the appended claims.

1. An arrangement for combining a front opening unified pod (FOUP)system and a reticle system for the transport of semiconductor wafersbetween processing sites, comprising structure modifying said FOUP so asto facilitate said FOUP transporting at least one reticle carrying asemiconductor wafer between said sites.
 2. An arrangement as claimed inclaim 1, wherein an adapter is provided for said at least one reticle;said adapter facilitating insertion and transport of said at least onereticle in said FOUP.
 3. An arrangement as claimed in claim 2, whereinsaid adapter comprises a plate member insertable into said FOUP, saidplate member including upstanding kinematic guide pins arrayed tomaintain wafers in predetermined positions on said at least one reticleduring transport in said FOUP.
 4. An arrangement as claimed in claim 1,wherein said FOUP includes structure for carrying up to at least threesaid reticles in a superimposed stacked position during transport ofsaid reticles between said sites, and wherein said structure comprises aportion of a FOUP door assembly.
 5. An arrangement as claimed in claim4, wherein an interface stocker system is provided for the transport ofreticles in Reticle Storage Pods (RSPs) to said FOUP adapter, saidstocker system including a reticle to FOUP adapter (RFA) storage forsupplying reticles to said FOUP.
 6. An arrangement as claimed in claim5, wherein overhead transport structure (OHT) is provided forpositioning said FOUP; a further overhead transport structure (RSP OHT)is provided for positioning said Reticle Storage Pods (RSPs) proximatesaid FOUPs; structure for introducing said Reticle Storage Pods intosaid FOUPs and closing said FOUPs; and conveying structure fortransporting the Reticle Storage Pod-containing FOUPs (RSP FOUPs) to aspecified manufacturing or processing site.
 7. An arrangement as claimedin claim 6, wherein sensors provide information and control for theloading and unloading of said Reticle Storage Pods (RSPs) into and fromsaid front opening unified pods (FOUPs).
 8. A system for transportingand tracking Reticle Storage Pods (RSPs) in Reticle Storage Pod—FOUPs(RSP FOUPs), between sites, including an arrangement for tracking RSPsvia RF pill rewriting to a reticle FOUP adapter (RFA) or FOUP RF pilland resetting thereof after an overhead transport vehicle (OHV) at adestination transfer site, whereby said RSP is removed from the RFA insaid FOUP.
 9. A system as claimed in claim 8, wherein a conveyorarrangement transports said RSP FOUPs between said manufacturing sites,and reconveyed emptied FOUPs to an initial said site for reloadingthereof with Reticle Storage Pods carrying semiconductor wafers.
 10. Asystem as claimed in claim 8, wherein structure is provided fortransporting a six-pack of said reticles in a FOUP.
 11. A system asclaimed in claim 10, wherein each said FOUP incorporates reticle adapterstructure to facilitate transport of said Reticle Storage Pods in saidFOUPs in a combined operative transport mode.
 12. A method of combininga front opening unified pod (FOUP) system and a reticle system for thetransport of semiconductor wafers between processing sites, said methodcomprising modifying said FOUP so as to facilitate said FOUPtransporting at least one reticle carrying a semiconductor wafer betweensaid sites.
 13. A method as claimed in claim 12, wherein an adapter isprovided for said at least one reticle; said adapter facilitatinginsertion and transport of said at least one reticle in said FOUP.
 14. Amethod as claimed in claim 13, wherein said adapter comprises providinga plate member which is insertable into said FOUP, said plate memberincluding upstanding guide pins arrayed to maintain wafers inpredetermined positions on said at least one reticle during transport insaid FOUP.
 15. A method as claimed in claim 12, wherein said FOUPcarries at least three said reticles in a superimposed stacked positionduring transport of said reticles between said sites.
 16. A method asclaimed in claim 17, wherein an interface stocker system is provided forthe transport of reticles in Reticle Storage Pods (RSPs) to said FOUPadapter, said stocker system including a reticle to FOUP adapter (RFA)storage for supplying reticles to said FOUP.
 17. A method as claimed inclaim 16, wherein overhead transport structure (OHT) is provided forpositioning said FOUP; a further overhead transport structure (RSP OHT)is provided for positioning said Reticle Storage Pods (RSPs) proximatesaid FOUPs; structure for introducing said Reticle Storage Pods intosaid FOUPs and closing said FOUPs; and conveying structure fortransporting the Reticle Storage Pod-containing FOUPs (RSP FOUPs) to aspecified manufacturing or processing site.
 18. A method as claimed inclaim 17, wherein sensors provide information and control for theloading and unloading of said Reticle Storage Pods (RSPs) into and fromsaid front opening unified pods (FOUPs).
 19. A method of transportingand tracking Reticle Storage Pods (RSPs) in Reticle Storage Pod—FOUPs(RSP FOUPs), between sites, including an arrangement for tracking RSPsvia RF pill rewriting to a reticle FOUP adapter (RFA) or FOUP RF pilland resetting thereof after an overhead transport vehicle (OHV) at adestination transfer site, whereby said RSP is removed from the RFA insaid FOUP.
 20. A method as claimed in claim 19, wherein a conveyorarrangement transports said RSP FOUPs between said manufacturing sites,and reconveyed emptied FOUPs to an initial said site for reloadingthereof with Reticle Storage Pods carrying semiconductor wafers.
 21. Amethod as claimed in claim 19, wherein structure is provided fortransporting a six-pack of said reticles in a FOUP.
 22. A method asclaimed in claim 21, wherein each said FOUP incorporates reticle adapterstructure to facilitate transport of said reticle storage pads in saidFOUPs in a combined operative transport mode.